Well-being through Robotic Hugs

From March 27-29, 2023, the AAAI 2023 Spring Symposia will feature the symposium „Socially Responsible AI for Well-being“ by Takashi Kido (Teikyo University, Japan) and Keiki Takadama (The University of Electro-Communications, Japan). The venue is usually Stanford University. For staffing reasons, this year the conference will be held at the Hyatt Regency in San Francisco. On March 28, Prof. Dr. Oliver Bendel will present the paper „Increasing Well-being through Robotic Hugs“, written by himself, Andrea Puljic, Robin Heiz, Furkan Tömen, and Ivan De Paola. From the abstract: „This paper addresses the question of how to increase the acceptability of a robot hug and whether such a hug contributes to well-being. It combines the lead author’s own research with pioneering research by Alexis E. Block and Katherine J. Kuchenbecker. First, the basics of this area are laid out with particular attention to the work of the two scientists. The authors then present HUGGIE Project I, which largely consisted of an online survey with nearly 300 participants, followed by HUGGIE Project II, which involved building a hugging robot and testing it on 136 people. At the end, the results are linked to current research by Block and Kuchenbecker, who have equipped their hugging robot with artificial intelligence to better respond to the needs of subjects.“ More information via aaai.org/conference/spring-symposia/sss23/.

Fig.: HUGGIE, Teddy, and the team (without Oliver Bendel)